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Comparing Digital and Analog X-ray Inspection for Component Analysis.

• Authors : Bernard, David¹ ; Ainsworth, Steve²

• Source: SMT: Surface Mount Technology. Jun2004, Vol. 18 Issue 6, p36-40. 4p. 2 Black and White Photographs, 2 Diagrams, 1 Chart.

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X-ray Choices for SMT Manufacturing.

• Authors : Pippert, Tami; Bernard, David

• Source: SMT: Surface Mount Technology. Nov2007, Vol. 21 Issue 11, p20-23. 3p.

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Expert Opinion.

• Authors : Bernard, David; Peak, Daniel A.

Subjects: INNOVATIONS in business; MANUFACTURING processes; INDUSTRIAL efficiencyPEPSICO Inc.BERNARD, David

• Source: Journal of Information Technology Case & Application Research; 2012, Vol. 14 Issue 2, p74-79, 6p

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Pb-Free, Moisture Sensitivity and X-Ray Inspection.

• Authors : Bernard, David¹

• Source: Circuits Assembly. Aug2005, Vol. 16 Issue 8, p26-27. 2p.

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An A-to-Z Guide to X-Ray Inspection, Part II.

• Authors : Bernard, David¹

• Source: Circuits Assembly. Jan2008, Vol. 19 Issue 1, p34-34. 1p.

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Measurement Variation in PIHR Pb-Free Solder Joints.

• Authors : Bernard, David¹ ; Willis, Bob²

• Source: Circuits Assembly. Mar2006, Vol. 17 Issue 3, p54-54. 1p.

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